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DELL Intel Xeon Platinum 8460Y+ processor 2 GHz 105 MB Tray

SKU
338-CHDC
-38%
Special Price $15,963.02 Regular Price $25,654.86
Out of stock
Intel Xeon Platinum 8460Y+ 2GHz Forty Core Processor, 40C/80T, 16GT/s, 105M Cache, Turbo, HT (300W) DDR5-4800
More Information
SKU 338-CHDC
Manufacturer DELL
Availability Out of Stock
The Intel Xeon Platinum 8460Y+ 2GHz Forty Core Processor enhances the performance and the speed of your system. Additionally, the Virtualization Technology enables migration of more environments. It supports enhanced SpeedStep technology that allows tradeoffs to be made between performance and power consumption.

Its Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. The VT-x with Extended Page Tables (EPT) also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Packed with more features, the Xeon Platinum 8460Y+ 2GHz Forty Core Processor is the ideal choice for virtually all of your data demanding or standard enterprise infrastructure applications.
Processor
Processor generationIntel Xeon Scalable 4th Gen
Processor base frequency2 GHz
Processor manufacturerIntel
Processor codenameSapphire Rapids
Thermal Design Power (TDP)300 W
Processor cache105 MB
Processor ARK ID231736
Processor familyIntel® Xeon® Platinum
Processor cores40
Processor socketLGA 4677 (Socket E)
Processor model8460Y+
Processor threads80
System bus rate16 GT/s
Processor operating modes64-bit
Processor boost frequency3.7 GHz
SteppingE5
Package typeTray
High priority cores12
High priority core frequency2.1 GHz
Low priority cores28
Low priority core frequency1.7 GHz
Memory
Maximum internal memory supported by processor6 TB
Memory types supported by processorDDR4-SDRAM
Memory channelsOcta-channel
ECCYes
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)300 W
Features
Maximum number of PCI Express lanes80
Thermal Design Power (TDP)300 W
Processor package size77.5 x 56.5 mm
Processor ARK ID231736
Execute Disable BitYes
PCI Express slots version5.0
Supported instruction setsAMX, SSE4.2, AVX, AVX 2.0, AVX-512
Scalability2S
Market segmentServer
Processor special features
Intel Software Guard Extensions (Intel SGX)Yes
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Intel® Speed Shift TechnologyYes
Intel® Turbo Boost Technology2.0
Intel Trusted Execution TechnologyYes
Intel® Hyper Threading Technology (Intel® HT Technology)Yes
Intel® AES New Instructions (Intel® AES-NI)Yes
Intel® OS GuardYes
Intel VT-x with Extended Page Tables (EPT)Yes
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Intel® Boot GuardYes
Intel® Speed Select technology - Performance Profile (Intel® SST-PP)Yes
Intel® Optane™ DC Persistent Memory SupportedYes
Intel® Deep Learning Boost (Intel® DL Boost) on CPUYes
Mode-based Execute Control (MBE)Yes
Intel® Run Sure TechnologyYes
Intel® Resource Director Technology (Intel® RDT)Yes
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF)Yes
Intel® Transactional Synchronization ExtensionsYes
Intel® Total Memory EncryptionYes
Intel® Control-flow Enforcement Technology (CET)Yes
Maximum Enclave Size Support for Intel® SGX128 GB
Intel® Platform Firmware Resilience SupportYes
Intel® Crypto AccelerationYes
Intel® QuickAssist Software AccelerationYes
Intel® On Demand Feature ActivationYes
Intel® QuickAssist Technology (QAT)1 default devices
Intel® Dynamic Load Balancer (DLB)1 default devices
Intel® Data Streaming Accelerator (DSA)1 default devices
Intel® In-memory Analytics Accelerator (IAA)1 default devices
Intel® Advanced Matrix Extensions (AMX)Yes
Operational conditions
Tcase76 °C
DTS Max95 °C
Technical details
Intel Virtualization Technology for Directed I/O (VT-d)Yes
Intel 64Yes
Thermal Design Power (TDP)300 W
Market segmentServer
Intel Virtualization Technology (VT-x)Yes
AVX-512 Fused Multiply-Add (FMA) units2
Packaging data
Package typeTray
Weight & dimensions
Processor package size77.5 x 56.5 mm
Other features
CompatibilityPowerEdge C6620 PowerEdge MX760C PowerEdge R660 PowerEdge R760 PowerEdge R760XA PowerEdge XE8640 PowerEdge XE9640 PowerEdge XE9680